It is interesting to know that while double-E's and computer geeks often seem to get the glory for "high tech" advances, much of this evolution has been made possible by numerous mechanical engineering achievements and other interdisciplinary efforts. Sophisticated packages encase tiny silicon chips to protect them from mechanical stresses, dissipate heat that could destroy the circuits within, and provide means to connect the semiconductor brains with useful input and output devices. Outer packaging further accomplishes these purposes along with presenting a finished product suitable for the consumer or industrial user.

Dr. John H. Lau's presentation will draw on 30 years of R&D and manufacturing experience in the electronics, photonics, petroleum, nuclear, and defense industries.

John now works as an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of optoelectronic packaging and manufacturing technology. Prior to Agilent, John worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company.

John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois, an M.S. degree in Structural Engineering from the University of British Columbia, a second M.S. degree in Engineering Mechanics from the University of Wisconsin, and a third M.S. degree in Management Science from Fairleigh Dickinson University. He also has a B.E. degree in Civil Engineering from National Taiwan University. John has given over 200 workshops and invited presentations, and is the author and editor of 20 books in the design, materials, process, manufacturing, and reliability of electronics and photonics packaging.

John has served in the editorial boards of the ASME Transactions, Journal of Electronic Packaging and IEEE Transactions on Components, Packaging, & Manufacturing Technology. He also served as invited speaker of several ASME, IEEE, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He received many awards from ASME and IEEE for best Proceedings and Transactions papers and outstanding technical achievements. He is a distinguished lecturer of the IEEE/CPMT as well as for ASME. Dr. Lau has been recognized with the Fellow grade of membership by both ASME International and IEEE.

Menu (choice of):

Canneloni Beef Ravenna a la Toscano (Red Sauce)

Or

Breast of Chicken Santa Fe with Southwestern Rice

Time:

6:00 - 6:30 p.m. "No-host" cocktails

6:30 - 7:30 p.m. Dinner

7:30 - 8:30 p.m. Presentation

8:30 - 9:00 p.m. Honoring 25/50 Year Members

Cost:

$25 Professionals

$10 Students

$30 Non-members

RSVP to rsvp@sf.asme.org or leave a message at 415-721-4478. Include number of attendees and entre choices. Also, please provide your phone number in case we need to call you.